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日月光半导体将发行新股及海外无担保公司债券

发布时间:2020-01-14 12:14:51 阅读: 来源:二氧化碳缓蚀剂厂家

元器件交易网讯 7月17日消息,台湾日月光半导体制造股份有限公司(ASE)已经宣布了公司将发行新股及海外无担保公司债券。公司将把股份和债券发行所得款项用于购买设备,扩大产能,以及确保足够的现金流。

日月光公司董事会于7月15日批准发行限制4亿美元为期5年的非台湾可换股债券。董事会还批准了一项单独的决议,通过发行1.28-1.6亿新股,来提高额外实收资本额。

日月光公布其股市收盘价日收于25.50新台币(0.86美元),该公司可能会从股票发行中提高至少30亿台币(约1亿美元)。

日月光先前披露,其2013年资本支出的大部分用于倒装芯片凸点和其他高端包装解决方案。封装和测试厂已设定2013年的资本开支目标为6亿-7亿美元。(元器件交易网郭路平 译)

外文:

ASE to raise additional capital through issuing new shares, bonds

Jessie Shen, DIGITIMES, Taipei [Tuesday 16 July 2013]

Taiwan-based Advanced Semiconductor Engineering (ASE) has announced plans to issue new shares and unsecured corporate bonds overseas. Proceeds from the share and bond issues will be used to buy equipment and expand capacity, as well as ensure sufficient cashflow.

ASE"s board of directors on July 15 approved the issuance of non-Taiwan convertible bonds with a limit of US$400 million and a period of five years. The board also approved a separate resolution raising additional paid-in capital through issuing 128-160 million new shares.

ASE closed at NT$25.50 (US$0.86) on the day of the announcement, and based on the closing share price, the company could raise at least NT$3 billion from the share issue.

ASE disclosed previously that the majority of its 2013 capex would be spent on flip-chip bumping and other high-end packaging solutions. The packaging and testing house already set a capex target of US$600-700 million for 2013.

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